Integrating electrothermal coupling analysis in the calibration of experimental electromigration reliability of flip-chip packages

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1421-1426

  Lai, Yi Shao ^a   Sathe, Sanjeev ^b   Kao, Chin Li ^a   Lee, Chiu Wen ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^b ASE (US) Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CALIBRATION; CURRENT DENSITY; ELECTROMIGRATION; FLIP CHIP DEVICES; RELIABILITY; THERMAL CONDUCTIVITY;

CURRENT CROWDING; ELECTROTHERMAL COUPLING; SOLDER BUMPS; SOLDER INTERCONNECTS;

ELECTRIC POWER SYSTEM INTERCONNECTION;

EID: 24644476182     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

1. Tu, K. N., "Recent Advances on Electromigration in Very-Large-Scale-Integration of Interconnects," J. Appl. Phys., Vol. 94, No. 9 (2003), pp. 5451-5473.
2. Blech, A., "Electromigration in Thin Aluminum Films on Titanium Nitride," J. Appl. Phys., Vol. 47, No. 4 (1976), pp. 1203-1208.
3. Lloyd, J. R., "Electromigration in Thin Film Conductors," Semicond. Sci. Technol., Vol. 12 (1997), pp. 1177-1185.
4. Tu, K. N., Electronic Thin Film Science for Electrical Engineers and Materials Scientists. Macmillan (New York, 1992).
5. nd Electr. Comp. Tech. Conf, San Diego, CA, 2002, pp. 452-457.
6. nd Electr. Comp. Tech. Conf, San Diego, CA, 2002, pp. 1201-1205.
7. th Int. Symp. Microelectr., Boston, PA, 2003, pp. 93-99.
8. Rinne, G. A., "Issues in Accelerated Electromigration of Solder Bumps," Microelectr. Reliab., Vol. 43, No. 12 (2003), pp. 1975-1980.
9. th Electr. Pack. Technol. Conf, Singapore, 2004, pp. 254-258.
10. Nah, J. W. et al, "Mechanism of Electromigration-induced Failure in the 97Pb-3Sn and 37Pb-63Sn Composite Solder Joints," J. Appl. Phys., Vol. 94, No. 12 (2003), pp. 7560-7566.
11. Lee, T.-Y. T. et ai, "A Study of Electromigration in 3-D Flip Chip Solder Joint Using Numerical Simulation of Heat Flux and Current Density," IEEE Trans. Comp. Pack. Technol, Vol. 27, No. 3 (2004), pp. 472-479.
12. th IEEE CPMT Conf. High Density Microsystem Design Pack. Comp. Failure Analysis, Shanghai, China, 2004, pp. 224-226.
13. Lai, Y.-S. and Kao, C.-L., "Characteristics of Current Crowding in Flip-chip Solder Bumps," Microelectr. Reliab. (2005), accepted.
14. Darveaux, R., "Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction," J. Electr. Pack., ASME, Vol. 124, No. 3 (2002), pp. 147-154.