In-situ observation of material migration in flip-chip solder joints under current stressing

Journal of Electronic Materials

Volumn 35, Issue 10, 2006, Pages 1781-1786

  Tsai, C M ^a   Lai, Yi Shao ^b   Lin, Y L ^a   Chang, C W ^a   Kao, C R ^c  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^c NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Electromigration; Flip chip; PbSn solder

Indexed keywords

EUTECTICS; FLIP CHIP DEVICES; SOLDERED JOINTS; STRESSES;

ELECTRON FLOW; PBSN SOLDER;

ELECTROMIGRATION;

EID: 33750181244     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0157-2     Document Type: Article

References (14)

1. E.C.C. Yeh, W.J. Choi, K.N. Tu, P. Elenius, and H. Balkan, Appl. Phys. Lett. 80, 580 (2002).
2. Y.C. Hu, Y.H. Lin, C.R. Kao, and K.N. Tu, J. Mater. Res. 18, 2544 (2003).
3. Y.H. Lin, Y.C. Hu, C.M. Tsai, C.R. Kao, and K.N. Tu, Acta Mater. 53, 2029 (2005).
4. A.T. Wu, K.N. Tu, J.R. Lloyd, N. Tamura, B.C. Valek, and C.R. Kao, Appl. Phys. Lett. 85, 2490 (2004).
5. K.N. Tu, J. Appl. Phys. 94, 5451 (2003).
6. Y.L. Lin, C.W. Chang, C.M. Tsai, C.W. Lee, and C.R. Kao, J. Electron. Mater. 35, 1010 (2006).
7. Y.H. Lin, C.M. Tsai, Y.C. Hu, Y.L. Lin, and C.R. Kao, J. Electron. Mater. 34, 27 (2005).
8. Y.H. Lin, C.M. Tsai, Y.C. Hu, Y.L. Lin, J.Y. Tsai, and C.R. Kao, Mater. Sci. Forum 475-479, 2655 (2005).
9. C.M. Tsai, Y.L. Lin, J.Y. Tsai. and C.R. Kao, J. Electron. Mater. 35, 1005 (2006).
10. T.-Y.T. Lee, T.Y. Lee, and K.N. Tu, IEEE Trans. Compon. Packaging Technol. 27, 472 (2004).
11. D. Halliday and R. Resnick, Fundamentals of Physics (New York: John Wiley & Sons, 1974), pp. 512-514.
12. D. Gupta, K. Vieregge, and W. Gust, Acta Mater. 47, 5 (1999).
13. A.T. Wu, A.M. Gusak, K.N. Tu, and C.R. Kao, Appl. Phys. Lett. 86, 241902 (2005).
14. R.J. Klein Wassink, Soldering in Electronics (New York: Electrochemical Society, 1989), pp. 166-167.