Calibration of electromigration reliability of flip-chip packages by electrothermal coupling analysis (Journal of Electronic Materials (2006) 35: 5 (972-977) DOI: 10.1007/BF02692556);Calibration of electromigration reliability of flip-chip packages by electrothermal coupling analysis

Journal of Electronic Materials

Volumn 35, Issue 5, 2006, Pages 972-977

  Lai, Y Shao ^a   Kao, Chin L ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Black's equation; Electromigration; Electrothermal coupling analysis; Reliability

Indexed keywords

CALIBRATION; CURRENT DENSITY; ELECTRIC CONDUCTIVITY; EQUATIONS OF MOTION; MICROPROCESSOR CHIPS; RELIABILITY; SOLDERED JOINTS;

BLACK'S EQUATION; ELECTROTHERMAL COUPLING ANALYSIS; JOULE HEATING; VOLUMETRICALLY AVERAGED CURRENT DENSITY;

ELECTROMIGRATION;

EID: 33745039790     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0374-3     Document Type: Erratum

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