Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages

Microelectronics Reliability

Volumn 46, Issue 8, 2006, Pages 1357-1368

  Lai, Yi Shao ^a   Kao, Chin Li ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CALIBRATION; COUPLED CIRCUITS; ELECTRIC CONDUCTIVITY; ELECTRIC CURRENTS; ELECTROMIGRATION; NUMERICAL METHODS; SOLDERING; THERMAL EFFECTS; TRACE ELEMENTS;

CURRENT CROWDING EFFECT; ELECTROTHERMAL COUPLING ANALYSIS; JOULE HEATING; SOLDER BUMPS;

FLIP CHIP DEVICES;

EID: 33746600287     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.08.009     Document Type: Article

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