A Comparison of Electromigration and Thermal Fatigue Performance Between Thin and Thick Film UBM

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5288, Issue , 2003, Pages 93-99

  Zheng, Po Jen ^a   Hung, C Y ^a   Lee, Z J ^a   Lee, C W ^a   Chung, C S ^a   Wu, J D ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Electromigration; Flip chip; Lifetime and fatigue life; Thermal fatigue; UBM

Indexed keywords

CRACK INITIATION; CURRENT DENSITY; ENERGY DISPERSIVE SPECTROSCOPY; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; METALLIZING; MICROSTRUCTURE; RELIABILITY; SCANNING ELECTRON MICROSCOPY; STATISTICAL METHODS; SUBSTRATES; TEMPERATURE; THERMOANALYSIS; THICK FILMS; THIN FILMS;

FLIP CHIP; LIFETIME AND FATIGUE LIFE; THERMAL FATIGUE; UBM;

ELECTROMIGRATION;

EID: 2342533914     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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