Assessment of die attach film for thin die and SiP applications

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2006, Pages 288-293

  Soh, Choew Kheng ^a   Teo, Mary ^a   Lee, Charles ^a  

^a INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CELLULAR RADIO SYSTEMS; DECISION MAKING; ELECTRIC CURRENTS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; INTERNET PROTOCOLS; MATERIALS TESTING; MOISTURE; MOLECULAR BEAM EPITAXY; OPTIMIZATION; PLANNING; RESOURCE ALLOCATION; TECHNOLOGY;

BALL-GRID-ARRAY PACKAGES; CUTTING DEPTHS; DIE ATTACH; DIE ATTACHMENT; ELECTRONICS MANUFACTURING; FEASIBILITY STUDIES; FEED RATES; HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST; INTERNATIONAL CONFERENCES; MOISTURE SENSITIVITY LEVEL; PASTE MATERIALS; PICK-UP; PROCESS-OPTIMIZATION; RELIABILITY PERFORMANCE; RELIABILITY TESTING; SIP APPLICATIONS; SYSTEM-IN-PACKAGE APPLICATIONS; TEMPERATURE CYCLING; THICKNESS REDUCTION; WHISKER FORMATION;

DIES;

EID: 50249180191     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2006.4456468     Document Type: Conference Paper

References (8)

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