Dicing die attach films for high volume stacked die application

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1312-1316

  Annette, Teng Cheung ^a  

^a CORWIL Technology Corp ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BACKGRIND; BACKSIDE ROUGHNESS; DIE ATTACH FILM (DAF); SIDEWALL CHIPPING;

ADHESION; CHEMICAL MECHANICAL POLISHING; ELECTRONICS PACKAGING; SHEAR STRENGTH;

THIN FILMS;

EID: 33845566704     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645824     Document Type: Conference Paper

References (10)

1. www.Nitto.com
2. www.Mitsuichemicals.com
3. www.Lintec-USA.com
4. T. Harder, W. Reinert, "Low-profile and flexible electronic assemblies using ultra-thin Silicon" Technology & Production for Flexible Electronic System, Nov. 26, 2002
5. www.Discousa.com
6. th Intl. Symposium on Adv. Packaging Materials Processes, Properties and Interfaces. Mar 16-18, 2005
7. M. Gerber and N. Arguello, "A Comparison between Single Versus Dual Spindle Processes for Copper Metallized Wafers," Proceedings of Electronic Components and Technology Conference, San Diego, CA, May 2002, pp. 1167-1171.
8. H.H. Jiun, I. Ahmad, A. Jalar and Omar, "Effect of Laminated Wafer Toward Dicing Process and Alternative Double Pass Sawing Method to Reduce Chipping," IEEE Transactions on Electronics Packaging Manufacturing. vol. 29. no. 1, pp. 17-24, Jan. 2006
9. Military Standard 883, Method 2010, "Internal Visual".
10. Annette Teng Cheung "Dicing Advanced Materials for Microelectronics" MEPTEC lunch presentation, Sunnyvale, Apr. 27, 2005