Evaluation of die edge cracking in flip-chip PBGA packages

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 4, 2003, Pages 719-723

  Mercado, Lei L ^a   Sarihan, Vijay ^a  

^a MOTOROLA INC   (United States)

Author keywords

Die cracking; Edge cracking; Energy release rate; Flaw size; Flip chip; Fracture mechanics; Horizontal fracture; PBGA; Sawing; Underfill

Indexed keywords

CRACK INITIATION; DIES; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; FRACTURE MECHANICS; RELIABILITY; THERMAL EXPANSION;

DIE CRACKING; EDGE CRACKING; ENERGY RELEASE RATE; FLAW SIZE; HORIZONTAL FRACTURE; PLASTIC BALL GRID ARRAY; SINGULATION INDUCED FLAWS; UNDERFILLS;

ELECTRONICS PACKAGING;

EID: 0742269312     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.821677     Document Type: Article

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