Methods for searching the cause of crack

Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Volumn , Issue , 2005, Pages 222-225

  Zhang, Bin ^a   Chen, Ning ^a   Zhang, Feizhou ^a  

^a INTEL CORPORATION   (China)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 28044459141     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. D.Broek,Elementary Engineer Fracture Mechanics. Netherlands: Noordhoff Int.Publ., 1974
2. Suryanayana,R.Hsiao,T.P.Gall,andJ.M.Mccreary,"Enhancement of flip-chip fatigue life by encapsulation,"IEEE trans. Comp.,Hybirds, Manufact.Technol.,vol. 14,pp.218-223,Mar. 1991
3. A.Amerasekera and C. Duvvury, ESD in Silicon Integrated Circuits. Chichester, U.K.: Wiley, 1995, p. 181
4. C.C.M.van Kessel,unpublished results.A