A comparison between single versus dual spindle saw processes for copper metallized wafers

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1167-1171

  Gerber, Mark ^a   Arguello, Noel ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COPPER; HIGH TEMPERATURE OPERATIONS; METALLIZING; SAWING;

COPPER METALLIZED WAFERS;

SILICON WAFERS;

EID: 0036294558     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Dicing saw developments in semiconductor manufacturing
2. Optimizing the wafer dicing process
3. Method to evaluate damage induced by dicing and laser cutting of silicon wafers
4. Solving dicing problems
5. Characterization of the wafer dicing process using Taguchi methodology
6. Differences between aluminum and copper wafer metallization in the wafer saw process for thin BGA packages