Challenges and solutions for cost-effective RF-MEMS packaging

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2007, Pages 278-285

  Morris, Art ^a   Cunningham, Shawn ^a  

^a Wispry Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COST CONSTRAINTS; ELECTRONICS MANUFACTURING; ENGINEERING FIELDS; FINAL PRODUCTS; FUNCTIONAL INTEGRATION; FUTURE RESEARCH; MEMS DEVICES; MICRO-ELECTRO MECHANICAL SYSTEMS; MOBILE WIRELESS TERMINALS; NUMBER OF COMPONENTS; ON CURRENTS; RF PERFORMANCE; RF-MEMS; SEMICONDUCTOR INDUSTRIES; TECHNICAL BENEFITS;

COST EFFECTIVENESS; ELECTRIC BREAKDOWN; ENGINEERING RESEARCH; ENVIRONMENTAL ENGINEERING; ENVIRONMENTAL PROTECTION; MANUFACTURE; MEMS; MICROELECTROMECHANICAL DEVICES; SEMICONDUCTOR DEVICE MANUFACTURE; SOLUTIONS; TECHNOLOGY; WIRELESS TELECOMMUNICATION SYSTEMS;

COMPOSITE MICROMECHANICS;

EID: 48149085897     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2007.4417077     Document Type: Conference Paper

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