A wafer-level packaging approach for MEMS & related microsystems using selective Laser-Assisted Bonding (LAB)

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1099-1102

  Mohan, Ashwin ^a   O'Neal, Chad B ^b   Malshe, Ajay P ^a   Foster, Ron B ^c  

^a 3202 Bell Engineering Center   (United States)

^b LOUISIANA TECH UNIVERSITY   (United States)

^c UNIVERSITY OF ARKANSAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC MICROSCOPES; BONDING; HERMETIC DEVICES; LOW TEMPERATURE EFFECTS; MICROELECTROMECHANICAL DEVICES; OPTICAL MICROSCOPY; PRESSURE EFFECTS; SILICON WAFERS; SOLDERING ALLOYS; X RAY MICROSCOPES;

LASER-ASSISTED BONDING (LAB); LOW TEMPERATURE SOLDERS; MICROSYSTEMS;

ELECTRONICS PACKAGING;

EID: 24644475781     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ectc.2005.1441409     Document Type: Conference Paper

References (13)

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