Integration of 0/1-level packaged RF-MEMS devices on MCM-D at millimeter-wave frequencies

IEEE Transactions on Advanced Packaging

Volumn 30, Issue 3, 2007, Pages 369-376

  Carchon, Geert J ^a   Jourdain, Anne ^a   Vendier, Olivier ^b   Schoebel, Joerg ^c,d   Tilmans, Harrie A C ^a  

^a IMEC   (Belgium)

^b Thomson AleniaSpace BP 1187 ^*  (France)

^c ROBERT BOSCH GMBH   (Germany)

^d TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

Author keywords

0 level packaging; Integrated passives; MCM D; Millimeter wave; RF MEMS

Indexed keywords

BONDING; COPLANAR WAVEGUIDES; FLIP CHIP DEVICES; MILLIMETER WAVES; SHEAR STRENGTH; SUBSTRATES; THIN FILMS;

INTEGRATED PASSIVES; MULTILAYER THIN-FILM INTERCONNET SUBSTRATE; ON-CHIP CAVITY;

MEMS;

EID: 34548178008     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2007.901772     Document Type: Article

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