Modeling-based design optimization of wafer-level and chip-scale packaging for RF-MEMS devices

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1814-1818

  Kelley, Matt ^a   Malshe, Ajay P ^a   Barlow, Fred ^a  

^a UNIVERSITY OF ARKANSAS   (United States)

Author keywords

Chip scale; Modeling and simulation; Packaging; RF MEMS; Wafer level

Indexed keywords

CHIP-SCALE PACKAGING; HIGH RESISTIVITY SILICON; LOW TEMPERATURE CO-FIRED CERAMICS (LTCC); RF-MEMS SWITCHES;

CERAMIC MATERIALS; COMPUTER SIMULATION; ELECTRIC SWITCHES; ENCAPSULATION; MICROELECTROMECHANICAL DEVICES; MICROWAVES; SILICON; SUBSTRATES; WAVEGUIDES; WSI CIRCUITS;

ELECTRONICS PACKAGING;

EID: 24644497771     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. th Annual Intl. Reliability Physics Symposium, pp. 111-115, 2002.
2. Erik Jung, "Packaging Options for MEMS," MRS Bulletin, pp. 51-54, January 2003.
3. Brian C. Wadell. "Transmission Line Design Handbook," Boston: Artech House, Inc., 1991, pp. 73-76.
4. Leszek J. Golonka, "LTCC package for MEMS device," Proc. of SPIE, Vol. 5124, 2003.
5. Adolfo C. Reyes, Samir M. El-Ghazaly, Steve Dorn, Michael Dydyk, Dieter K. Schroder, and Howard Patterson, "High Resistivity Si as a Microwave Substrate," 1996 ECTC Conference, pp. 382-389.
6. Green Tape Systems Product Selectors Guide, November 04, 2003-last update, Available: http://www.dupont.com/mcm/product/tape.html, May 15, 2004-accessed.
7. Zhimin J. Yao, Chuck Goldsmith, Susan Eshelman, and David Denniston. "Micromachined RF Signal Switching Devices on High Resistivity Silicon Substrates," ASME 1997. Vol. 62, pp. 69-73.
8. David M. Pozar, "Microwave Engineering," 2nd ed. John Wiley & Sons, Inc., New York, 1998.