Application of Au-Sn eutectic bonding in hermetic RF MEMS wafer level packaging

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 9, Issue , 2004, Pages 215-219

  Kim, Woonbae ^a   Wang, Qian ^a   Jung, Kyudong ^a   Hwang, Junsik ^a   Moon, Changyoul ^a  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Au Sn eutectic bonding; RF MEMS

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; EUTECTICS; HERMETIC DEVICES; INTEGRATED CIRCUITS; MICROELECTROMECHANICAL DEVICES; MICROWAVES; OPTIMIZATION; PARAMETER ESTIMATION; SCANNING ELECTRON MICROSCOPY;

AU-SN EUTECTIC BONDING; MICRO-SWITCHES; RF-MEMS (RADIO FREQUENCY MICRO ELECTRO MECHANICAL SYSTEMS); THERMAL FATIGUE;

GOLD;

EID: 2442505703     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2004.1288016     Document Type: Conference Paper

References (12)

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