MEMS packaging - Current issues and approaches

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4217, Issue , 2002, Pages 208-213

  Dressendorfer, Paul V ^a   Peterson, David A ^a   Reber, Cathy A ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Assembly; Die separation; Hermeticity; MEMS; Packaging; Stress; Wafer bonding

Indexed keywords

ASSEMBLY; BONDING; DIES; ELECTRONICS PACKAGING; HERMETIC DEVICES; INTEGRATED CIRCUITS; SEALING (CLOSING); SENSORS; STRESSES;

DIE SEPARATION; HERMETIC SEALING; HERMETICITY; LOW STRESS DIE ATTACH; OPTICAL COMPONENTS; PRECISION DIE PLACEMENT; WAFER BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 0036389076     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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