-
1
-
-
0342997916
-
-
US Patent 4,954,142, 1990
-
W. Jeffrey, L.D. David, W.L. Guthrie, J. Hopewell, F.B. Kaufman, W.J. Patrick, K.P. Rodbell, R.W. Pasco, A. Nenadic, US Patent 4,954,142, 1990.
-
-
-
Jeffrey, W.1
David, L.D.2
Guthrie, W.L.3
Hopewell, J.4
Kaufman, F.B.5
Patrick, W.J.6
Rodbell, K.P.7
Pasco, R.W.8
Nenadic, A.9
-
2
-
-
0342563609
-
-
US Patent 4,702,792, 1987
-
M.-F. Chow, W.L. Guthrie, F.B. Kaufman, US Patent 4,702,792, 1987.
-
-
-
Chow, M.-F.1
Guthrie, W.L.2
Kaufman, F.B.3
-
3
-
-
0343869264
-
Reverse pillar - A self-aligned and self-planarized metallisation scheme for submicron technology
-
Yeh J.L., Hills G.W., Cochran W.T., Rana V.V., Garcia A.M. Reverse pillar - a self-aligned and self-planarized metallisation scheme for submicron technology. Vacuum. 38:1988;817-822.
-
(1988)
Vacuum
, vol.38
, pp. 817-822
-
-
Yeh, J.L.1
Hills, G.W.2
Cochran, W.T.3
Rana, V.V.4
Garcia, A.M.5
-
4
-
-
0024139494
-
Submicron wiring technology with tungsten and planarization
-
C. Kanta, W. Cote, J. Cronin, K. Holland, P.-I. Lee, T. Wright, Submicron wiring technology with tungsten and planarization, Proc. Fifth International IEEE VLSI Interconnection Conference, 1988, pp. 21-28.
-
(1988)
Proc. Fifth International IEEE VLSI Interconnection Conference
, pp. 21-28
-
-
Kanta, C.1
Cote, W.2
Cronin, J.3
Holland, K.4
Lee, P.-I.5
Wright, T.6
-
5
-
-
0343433556
-
Moving wafers: would you lug a $2 Mil load?
-
Oct. 20
-
M. Holstetler, Moving wafers: would you lug a $2 Mil load?, Investors Business Daily, Oct. 20, 1997.
-
(1997)
Investors Business Daily
-
-
Holstetler, M.1
-
8
-
-
0342563607
-
Industry Watch: SEMATECH expects decade of momentous change
-
Anonymous, December
-
Anonymous, Industry Watch: SEMATECH expects decade of momentous change, Semiconductor International, December 1997, pp. 17-18.
-
(1997)
Semiconductor International
, pp. 17-18
-
-
-
9
-
-
0020734181
-
Properties of low pressure CVD tungsten silicide as related to IC process requirements
-
Brors D.L., Fair J.A., Monnig K.A., Saraswat K.C. Properties of low pressure CVD tungsten silicide as related to IC process requirements. Solid State Technology. 26:1983;183-186.
-
(1983)
Solid State Technology
, vol.26
, pp. 183-186
-
-
Brors, D.L.1
Fair, J.A.2
Monnig, K.A.3
Saraswat, K.C.4
-
10
-
-
0001611894
-
The theory and design of plate glass polishing machines
-
Preston The theory and design of plate glass polishing machines. J. Soc. Glass Technol. 11:1927;214-256.
-
(1927)
J. Soc. Glass Technol.
, vol.11
, pp. 214-256
-
-
Preston1
-
11
-
-
13344270633
-
Contact and rubbing of flat surfaces
-
Archard J.F. Contact and rubbing of flat surfaces. J. Appl. Phys. 24:1953;981-985.
-
(1953)
J. Appl. Phys.
, vol.24
, pp. 981-985
-
-
Archard, J.F.1
-
12
-
-
84959331478
-
A modification to Preston's equation and impact on pattern density effect modeling, Program abstracts
-
Sept. 30-Oct. 2, San Diego, CA, University Extension, Univ. of California, Berkeley
-
A. Maury, D. Ouma, D. Boning, J. Chung, A modification to Preston's equation and impact on pattern density effect modeling, Program abstracts, Advanced Metallization and Interconnect Systems for USLI Applications, Sept. 30-Oct. 2, 1997, San Diego, CA, University Extension, Univ. of California, Berkeley.
-
(1997)
Advanced Metallization and Interconnect Systems for USLI Applications
-
-
Maury, A.1
Ouma, D.2
Boning, D.3
Chung, J.4
-
13
-
-
0028444787
-
Tribology analysis of chemical-mechanical polishing
-
Runnels S.C., Eyman L.M. Tribology analysis of chemical-mechanical polishing. J. Electrochem. Soc. 141(6):1993;1698-1701.
-
(1993)
J. Electrochem. Soc.
, vol.141
, Issue.6
, pp. 1698-1701
-
-
Runnels, S.C.1
Eyman, L.M.2
-
18
-
-
0017896512
-
Strain rate effects in low speed two-body abrasion
-
Larsen-Basse J., Tanouye P.A. Strain rate effects in low speed two-body abrasion. J. Lub. Tech. 100:1978;181-184.
-
(1978)
J. Lub. Tech.
, vol.100
, pp. 181-184
-
-
Larsen-Basse, J.1
Tanouye, P.A.2
-
21
-
-
0000698193
-
Trans AIME, The abrasion resistance of some hardened and tempered carbon steels
-
Larsen-Basse J. Trans AIME, The abrasion resistance of some hardened and tempered carbon steels. Trans. Met. Soc. AIME. 236:1966;1461-1466.
-
(1966)
Trans. Met. Soc. AIME
, vol.236
, pp. 1461-1466
-
-
Larsen-Basse, J.1
-
22
-
-
0002416820
-
Influence of grit diameter and specimen size on wear during sliding abrasion
-
Larsen-Basse J. Influence of grit diameter and specimen size on wear during sliding abrasion. Wear. 12:1968;35-53.
-
(1968)
Wear
, vol.12
, pp. 35-53
-
-
Larsen-Basse, J.1
-
25
-
-
0343433551
-
An electrochemical approach to slurry characterization and development for W CMP
-
The Electrochemical Society, Pennington, NJ
-
C. Streintz, D. Ligocki, T. Myers, V. Brusic, An electrochemical approach to slurry characterization and development for W CMP, Proc. 5th Int. Sympos. on Chemical Mechanical Planarization (CMP) in IC Device Manufacturing, The Electrochemical Society, Pennington, NJ, 1996, pp. 159-162.
-
(1996)
Proc. 5th Int. Sympos. on Chemical Mechanical Planarization (CMP) in IC Device Manufacturing
, pp. 159-162
-
-
Streintz, C.1
Ligocki, D.2
Myers, T.3
Brusic, V.4
-
26
-
-
0026260129
-
Chemical-mechanical polishing for fabricating patterned W metal features as chip interconnects
-
Kaufman, Thompson D.B., Brodie R.E., Jaso M.A., Guthrie W.L., Pearson D.J., Small M.B. Chemical-mechanical polishing for fabricating patterned W metal features as chip interconnects. J. Electrochem. Soc. 138:1991;3460-3465.
-
(1991)
J. Electrochem. Soc.
, vol.138
, pp. 3460-3465
-
-
Kaufman1
Thompson, D.B.2
Brodie, R.E.3
Jaso, M.A.4
Guthrie, W.L.5
Pearson, D.J.6
Small, M.B.7
-
27
-
-
0031277984
-
Wear phenomena in chemical mechanical polishing
-
Liang, Kaufman F., Sevilla R., Anjur S. Wear phenomena in chemical mechanical polishing. Wear. 211:1997;271-279.
-
(1997)
Wear
, vol.211
, pp. 271-279
-
-
Liang1
Kaufman, F.2
Sevilla, R.3
Anjur, S.4
|