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Volumn 671, Issue , 2001, Pages

Copper CMP for dual damascene technology: Some considerations on the mechanism of Cu removal

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; CHEMICAL MECHANICAL POLISHING; COMPOSITION EFFECTS; COPPER OXIDES; HYDROGEN BONDS; LIGHT POLARIZATION; OXIDATION; PASSIVATION; PH EFFECTS; SLURRIES; THERMODYNAMIC STABILITY;

EID: 0035558858     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (9)

References (6)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.