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Volumn 671, Issue , 2001, Pages
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Copper CMP for dual damascene technology: Some considerations on the mechanism of Cu removal
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ADDITION REACTIONS;
CHEMICAL MECHANICAL POLISHING;
COMPOSITION EFFECTS;
COPPER OXIDES;
HYDROGEN BONDS;
LIGHT POLARIZATION;
OXIDATION;
PASSIVATION;
PH EFFECTS;
SLURRIES;
THERMODYNAMIC STABILITY;
COPPER DUAL DAMASCENE;
REMOVAL RATE;
COPPER;
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EID: 0035558858
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (9)
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References (6)
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