An exploration of the copper CMP removal mechanism

Materials Research Society Symposium - Proceedings

Volumn 566, Issue , 1999, Pages 155-160

  Renteln, Peter ^a   Ninh, Ton ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASION; CHEMICAL POLISHING; DISSOLUTION; OXIDATION; REACTION KINETICS; SLURRIES; TEMPERATURE;

ABRASION ASSISTED DISSOLUTION; CHEMICAL MECHANICAL POLISHING; LOW REMOVAL RATE; OXIDATION COMPLEX RATE; OXIDIZER;

COPPER;

EID: 0033738241     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-566-155     Document Type: Article

References (13)

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