Oxide CMP mechanisms

Solid State Technology

Volumn 40, Issue 7, 1997, Pages 169-175

  Tomozawa, Minoru ^a,b,c,d,e  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b UNIVERSITY OF PENNSYLVANIA   (United States)

^c Glass and Optical Materials Division   (United States)

^d AMERICAN CERAMIC SOCIETY   (United States)

^e Rensselaer Polytechnic Institute   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; DEHYDRATION; HEATING; MATHEMATICAL MODELS; OPTICAL GLASS; PLASTIC DEFORMATION; STRESSES; TRIBOLOGY;

OXIDE CHEMICAL MECHANICAL POLISHING (CMP);

CHEMICAL POLISHING;

EID: 0031173556     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (20)

1. C.-W. Liu, B.-T. Dai, C.-F. Yeh, "Characterization of Chemical Mechanical Polishing Process Based on Nanoindentation Measurment of Dielectric Films," J. Electrochem. Soc. 142, 3098, 1995.
2. T. Izumitani, S. Harada, "Polishing Mechanism of Optical Glasses," Glass Technol., 12, 131, 1971.
3. T. Izumitani, "Polishing Lapping, and Diamond Grinding of Optical Galsses," Treatise on Materials Science and Technology, Vol. 17, Glass II, ed. by M. Tomozawa and R.H. Doremus, Academic Press, New York, p. 115, 1979.
4. W.L. Patrick, W.L. Guthric, C.L. Standley, P.M. Schiable, "Application of Chemical Mechanical Polishing to the Fabrication on VLSI Circuit Interconnection," J. Electrochem. Soc., 138, 1778, 1991.
5. F.W. Preston, "The Theory and Design of Plate Glass Polishing Machines," J. Soc. Glass Technol. 11, 214, 1927.
6. T. Izumitani, S. Harada, "Polishing Mechanism of Optical Glassess," Glass Technol. 12, 131, 1971.
7. T. Izumitani, "Polishing Lapping, and Diamond Grinding of Optical Glassess," Treatise on Materials Science and Technology, Vol. 17, Glass II, ed. by M. Tomozawa and R.H. Doremus, Acadamic Press, New York, p. 115, 1979.
8. J.F. Archard, "Contact and Rubbing of Flat Surface," J. Appl. Phys. 24, 961, 1953.
9. L.M. Hutchings, in Tribology, Friction and Wear of Engineering Materials, CRC Press, Boca Raton, pp. 136 and 142, 1992.
10. J.H. Westbrool, "Hardness Temperature Characteristics of Some Simple Glassess," Phys. Chem. Glassess, 2, 32, 1960.
11. F. Sugimoto, Y.; Arimoto, T. Ito, "Simultaneous Temperature Measurement of Wafars in Chemical Mechanical Polishing of Silicon Dioxide Layer," Jpn. J. Appl. Phys. 34, 6314, 1995.
12. 2 Glass in Various Environments," J. Am. Caram. Soc. 70, 497, 1987.
13. M. Tomozawa, K. Hirao, "Diffusion of Wafer into Oxides during Microhardness Indentation," J. Mat. Sci. Letters, 6, 867, 1967.
14. M. Tomozawa, K. Yang, H. Li, S. Muraka, "Basic Science in Silicon Glass Polidhing," in Advanced Metallzation for Devilces and Circuits-Science, Technology and Manufacturability, MRS Symposium Vol. 337, ed. by S.P. Murarka, A. Katz, K.N. Tu, K. Maex, Materials Research Society, Pittsburgh, PA, p. 89, 1994.
15. J.H. Westbrook, P.J. Jorgenson, "Indentation Creep of Solids," Trans. AIME, 223, 425, 1965.
16. K.M. Davis, M. Tomozawa, "An Infrared Spectroscopic Study of Wafer-Related Species in Silica Glass," J. Non-Cryst. Solids, 201, 177, 1995.
17. C.-W. Liu, B.-T. Dai, C.-F. Yeh, "Characterization of Chemical Mecharical Polishing Peocess Based on Nanoindentation Measurement of Dielectric Films," J. Electrochem, Soc. 142, 3098, 1995.
18. L. Cook, "Chemical Processes in Glass Polishing, J. Non-Cryst. Solids, 120, 160, 1990.
19. R.K. Ier, Chemistry of Silica, Wiley, New York, p. 65, 1979.
20. Y. Hayashi et al., "Ammouium Sat Added Silica Slurry for the Chemical Mechanical Polishing of the Interlayer Delectric Film Planarization in ULSis," Jpn. J. App. Phys. 34, 1037, 1995.