Investigation of the kinetics of tungsten chemical mechanical polishing in potassium iodate-based slurries. II. Roles of colloid species and slurry chemistry

Journal of the Electrochemical Society

Volumn 146, Issue 5, 1999, Pages 1934-1938

  Stein, David J ^a,b   Hetherington, Dale L ^b   Cecchi, Joseph L ^a  

^a University of New Mexico   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; CERIUM COMPOUNDS; CHEMICAL POLISHING; COLLOIDS; PH EFFECTS; POTASSIUM COMPOUNDS; PRESSURE EFFECTS; REACTION KINETICS; SLURRIES; SURFACE CHEMISTRY; YTTRIUM COMPOUNDS; ZIRCONIA;

CHEMICAL MECHANICAL POLISHING; POTASSIUM IODATE;

TUNGSTEN;

EID: 0032688973     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1391869     Document Type: Article

References (8)

1. D. J. Stein, D. L. Hetherington, J. L. Cecchi, J. Electrochem. Soc., 145, 376 (1999).
2. L. M. Cook, J. Non-Cryst. Solids, 120, 152 (1990).
3. E. Rabinowicz, Friction and Wear of Materials, 2nd ed., John Wiley & Sons, New York (1995).
4. I. L. Singer, J. Vac. Sci. Technol. A, 12, 2605 (1994).
5. J. Krim, Langmuir, 12, 4564 (1996).
6. D. J. Stein, D. L. Hetherington, and J. L. Cecchi, To be published.
7. J. N. Israelachvili, Y-L. Chen, and H. Yoshizawa, J. Adhes. Sci. Technol., 8, 1231 (1994).
8. D. Stein, D. Hetherington, M. Dugger, and T. Stout, J. Electron. Mater., 25, 1623 (1996).