The growth behavior and stress evolution of sputtering-deposited LaNiO3 thin films

Materials Science and Engineering: A

Volumn 474, Issue 1-2, 2008, Pages 134-139

  Zhao, Sha ^a   Ma, Fei ^a   Song, Zhongxiao ^a   Xu, Kewei ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

Growth mode; LaNiO3 thin films; Magnetron sputtering; Residual stress; Thickness effect

Indexed keywords

COMPRESSIVE STRESS; FILM THICKNESS; GRAIN GROWTH; GRAIN SIZE AND SHAPE; LANTHANUM COMPOUNDS; MAGNETRON SPUTTERING; MORPHOLOGY; RESIDUAL STRESSES; STRESS CONCENTRATION; TENSILE STRESS; THERMAL STRESS;

HYGROSCOPIC EXTRINSIC STRESS; RADIO FREQUENCY MAGNETRON SPUTTERING; STRESS EVOLUTION;

THIN FILMS;

COMPRESSIVE STRESS; FILM THICKNESS; GRAIN GROWTH; GRAIN SIZE AND SHAPE; LANTHANUM COMPOUNDS; MAGNETRON SPUTTERING; MORPHOLOGY; RESIDUAL STRESSES; STRESS CONCENTRATION; TENSILE STRESS; THERMAL STRESS; THIN FILMS;

EID: 37649018202     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.04.004     Document Type: Article

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