An experimental investigation of material removal rate in polishing of silicon wafers

Transactions of the North American Manufacturing Research Institution of SME

Volumn 35, Issue , 2007, Pages 17-24

  Zhang, X H ^a   Pel, Z J ^a   Esayanur, M ^b   Bowers, G L ^b   Fisher, G R ^b  

^a Kansas State University

^b MEMC Electronic Materials Inc   (United States)

Author keywords

Material removal rate (MRR); Pad speed; Polishing; Polishing pressure; Silicon wafer

Indexed keywords

INTEGRATED CIRCUITS; POLISHING; THERMAL EFFECTS;

MATERIAL REMOVAL RATE; WAFER QUALITY;

SILICON WAFERS;

EID: 34547959707     PISSN: 10473025     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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