Combining a finite element model and a removal model to evaluate the effect of wafer and pad shape on removal in CMP

Proceedings - Electrochemical Society

Volumn 21, Issue , 2003, Pages 305-312

  McGrath, John ^a   Davis, Chris ^a  

^a UNIVERSITY OF LIMERICK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); MATHEMATICAL MODELS; SEMICONDUCTING FILMS; STRAIN;

ABRASIVE EFFECTS; FILM STRESS; MATERIAL REMOVAL; PLANARIZATION;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 3042728733     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

1. F.W. Preston, Journal of The Society of Glass Technology, (11) 214-256 (1927).
2. C. Srinivasa-Murthy, D. Wang, S.P. Beaudoin, T. Bibby, K. Holland, T.S. Cale, Thin Solid Films, 308-309 (1997) 533-537.
3. Y. Zhang, P. Parikh, B. Stephenson, M. Bonsaver, J. Ling, M. Li, Effect of PETEOS Film Stress on Chemical Mechanical Planarization, Proc. of VLSI Multilevel Interconnect Conf., 424-426 (1996).
4. W-T. Tseng, Y-H. Wang, J-H. Chin, J. Electrochem. Soc., 146 (11) 4273-4280 (1999).
5. C-P, Chen, C-T. Lee, C-F. Lin, H-C. Yung, L. Fang, On the CMP characteristics of dual frequency deposited oxide films, Proc. of CMP-MIC, 112-115, 1996.
6. J. McGrath, C. Davis, J. McGrath, Journal of Materials Processing Technology, 132 (2002) 16-20.
7. D. Wang, J. Lee, K. Holland, T. Bibby, S. Beaudoin, T. Cale, J. Electrochem. Soc., 144 (3) 1121-11127 (1997).
8. B. Mullany, CMP of oxide coated silicon wafers, PhD Thesis, UCD, Dublin 2001.
9. Y-Y. Lin, S-P. Lo, Journal of Materials Processing Technology, 140 (2003) 646-652.
10. Y. Moon, D.A. Dornfeld, The Effect of Slurry Film Thickness Variation in Chemical Mechanical Polishing (CMP), Proc. of American Soc. for Precision Eng., 18 (1998) 591-596.
11. J. Sarooshian, A. Philipossian, M. Goldstein, S. Beaudoin, W.Huber, Effect of variations in wafer diameter, wafer shape and thermal history on pressure and stress distributions during CMP, Proc. of CMP-MIC, (2003), 355-361.
12. J. McGrath, C. Davis, N. Townsend, J. McGrath, Analysis of a Theoretical Model for the Effect of Pad Conditioning on Pad Wear in Chemical Mechanical Polishing for Planarization, Proc. of Adv. in Manuf. Tech. XVI, 411-415 (2002).