Dependency of dishing on polish time and slurry chemistry in Cu CMP

Microelectronic Engineering

Volumn 50, Issue 1-4, 2000, Pages 403-410

  Nguyen, V ^a   Vankranenburg, H ^a   Woerlee, P ^a,b  

^a UNIVERSITY OF TWENTE   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CARBOXYLIC ACIDS; CHEMICAL POLISHING; COPPER; OXIDATION; PH; SALTS; SLURRIES;

CHEMICAL MECHANICAL POLISHING (CMP); DISHING;

METALLIC FILMS;

EID: 0033639551     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(99)00308-1     Document Type: Article

References (5)

1. Murarka S.P. Metallisation. 1993;100 Butterworth-Heinemann, Boston.
2. van Kranenburg H., Woerlee P.H. J. Electrochem. Soc. 145:1998;1285.
3. Warnock J. J. Electrochem. Soc. 138:1991;2398.
4. Zeidler D., Stavreva Z., Plotner M., Drescher K. Microelectron. Eng. 3738:1997;237.
5. Pourbaix M. Atlas of Electrochemical Equilibria in Aqueous Solutions. 1966;Pergamon, Oxford.