Improvement of Cu CMP by optimization of abrasive in slurry

Advanced Metallization Conference (AMC)

Volumn , Issue , 2004, Pages 589-593

  Minamihaba, Gaku ^a   Yano, Hiroyuki ^a   Kurashima, Nobuyuki ^a   Yoda, Takashi ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; CHEMICAL MECHANICAL POLISHING; COPPER; OPTICAL MICROSCOPY; OPTIMIZATION; PRODUCTIVITY; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICE MANUFACTURE; SILICA;

ABRASIVE GRAINS; SHEET RESISTANCE; SILICA ABRASIVES; SLURRY OPTIMIZATION;

SLURRIES;

EID: 23844525557     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. H. Miyajima, K Fujita, R. Nakata, T. Yoda and N. Hayasaka, IITC 2004, p. 222.
2. N. Nakamura, T. Yoshizawa, T. Watanabe, H. Miyajima, S. Nakao, N. Yamada, K. Fujita, N. Matsunaga and H. Shibata, IITC 2004, p. 228.