Study on planarization of silicon-wafer by CMP

Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C

Volumn 68, Issue 10, 2002, Pages 3108-3114

  Sasaki, Yoshiaki ^a   Aoyama, Hideki ^a   Inasaki, Ichiro ^a   Shibaya, Hiroshi ^a  

^a KEIO UNIVERSITY   (Japan)

Author keywords

CMP (Chemical Mechanical Polishing); FEM; Polishing Rate; Pressure Distribution

Indexed keywords

CHEMICAL MECHANICAL POLISHING; DIELECTRIC FILMS; FINITE ELEMENT METHOD; LSI CIRCUITS; PRESSURE DISTRIBUTION; SLURRIES;

PLANARIZATION;

SILICON WAFERS;

EID: 0036818453     PISSN: 03875024     EISSN: None     Source Type: Journal    
DOI: 10.1299/kikaic.68.3108     Document Type: Article

References (0)