Heat transport in thin dielectric films

Journal of Applied Physics

Volumn 81, Issue 6, 1997, Pages 2590-2595

  Lee, S M ^a   Cahill, David G ^a  

^a University of Illinois at Urbana Champaign   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; CHROMIUM; HEAT RESISTANCE; HEAT TRANSFER; OXIDATION; PLASMAS; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SILICA; SILICON NITRIDE; THERMAL CONDUCTIVITY; THIN FILMS;

FILM THICKNESS; MICROPORES; PLASMA ENHANCED CHEMICAL DEPOSITION; VOLTAGE DROP;

DIELECTRIC MATERIALS;

EID: 0031094623     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.363923     Document Type: Article

References (24)

1. J. C. Lambropoulos, M. R. Jolly, C. A. Amsden, S. E. Gilman, M. J. Sinicropi, D. Diakomihalis, and S. D. Jacobs, J. Appl. Phys. 66, 4230 (1989).
2. A. J. Griffin, Jr., F. R. Brotzen, and P. J. Loos, J. Appl. Phys. 75, 3761 (1994).
3. A. J. Griffin, Jr., F. R. Brotzen, and P. J. Loos, J. Appl. Phys. 76, 4007 (1994).
4. D. G. Cahill, M. Katiyar, and J. R. Abelson, Phys. Rev. B 50, 6077 (1994).
5. S.-M. Lee, D. G. Cahill, and T. H. Allen, Phys. Rev. B 52, 253 (1995).
6. K. E. Goodson, M. I. Flik, L. T. Su, and D. A. Antoniadis, IEEE Electron. Device Lett. 14, 490 (1993).
7. O. W. Käding, H. Skurk, and K. E. Goodson, Appl. Phys. Lett. 65, 1629 (1994).
8. We have also found that the adhesion improves if the samples are kept at ∼90 °C for several minutes before loading the samples into the deposition chamber.
9. R. Reif and W. Kern, in Thin Film Processes II, edited by J. L. Vossen and W. Kern (Academic, Boston, 1991), p. 539.
10. D. G. Cahill, Rev. Sci. Instrum. 61, 802 (1990).
11. C. J. Glassbrenner and G. A. Slack, Phys. Rev. 134, A1058 (1964).
12. B. Abeles, C. D. Cody, J. P. Desmukes, E. F. Hockings, N. E. Lindenblad, D. Richman, and F. D. Rosi, RCA Lab. Quart. Rept. No. 8, 1 (1961).
13. P. Flubacher, A. J. Leadbetter, and J. A. Morrison, Phys. Rev. 4, 273 (1959); H. R. Shanks, P. D. Maycock, P. H. Sidles, and G. C. Danielson, Phys. Rev. 130, 1743 (1963).
14. P. Flubacher, A. J. Leadbetter, and J. A. Morrison, Phys. Rev. 4, 273 (1959); H. R. Shanks, P. D. Maycock, P. H. Sidles, and G. C. Danielson, Phys. Rev. 130, 1743 (1963).
15. S.-M. Lee and S.-I. Kwun, Rev. Sci. Instrum. 65, 966 (1994).
16. For relatively thick films, t>100 nm, the measurement errors are dominated by uncertainties in the linewidth w=8.0±0.5μm; see Eq. (2).
17. D. G. Cahill and T. H. Allen, Appl. Phys. Lett. 65, 309 (1994).
18. R. Landauer, J. Appl. Phys. 23, 779 (1952).
19. D. G. Cahill, R. B. Stephens, R. H. Tait, S. K. Watson, and R. O. Pohl, in Thermal Conductivity, edited by C. J. Cremers and H. A. Fine (Plenum, New York, 1990), Vol. 21, pp. 3-16.
20. M. S. Love and A. C. Anderson, Phys. Rev. B 42, 1845 (1990).
21. K. E. Goodson, M. I. Flik, L. T. Su, and D. A. Antoniadis, J. Heat Transfer 116, 317 (1994).
22. E. T. Swartz and R. O. Pohl, Appl. Phys. Lett. 51, 2200 (1987).
23. R. J. Stoner and H. J. Maris, Phys. Rev. B 48, 16 373 (1993).
24. E. T. Swartz and R. O. Pohl, Rev. Mod. Phys. 61, 605 (1989).