Thermal conductivity measurements on thin films based on micromechanical devices

Journal of Micromechanics and Microengineering

Volumn 6, Issue 1, 1996, Pages 118-121

  Jansen, E ^a   Obermeier, E ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DIAMOND FILMS; FINITE ELEMENT METHOD; OPTIMIZATION; POLYCRYSTALLINE MATERIALS; SEMICONDUCTING SILICON; SUBSTRATES; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL VARIABLES MEASUREMENT;

MICROMECHANICAL DEVICES;

THIN FILMS;

EID: 0030091524     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/6/1/029     Document Type: Article

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