Laser bonding of glass to silicon using polymer for microsystems packaging

Journal of Microelectromechanical Systems

Volumn 16, Issue 3, 2007, Pages 571-580

  Bardin, Fabrice ^a   Kloss, Stephan ^b   Wang, Changh Hai ^b   Moore, Andrew J ^b,c   Jourdain, Anne ^d   De Wolf, Ingrid ^d   Hand, Duncan P ^b  

^a University of Nimes   (France)

^b HERIOT WATT UNIVERSITY   (United Kingdom)

^c AWE   (United Kingdom)

^d IMEC   (Belgium)

Author keywords

Laser bonding; Microelectromechanical system (MEMS) packaging; Wafer bonding

Indexed keywords

BOND STRENGTH (MATERIALS); ELECTRONICS PACKAGING; LASER HEATING; MATERIALS TESTING; POLYMERS; SEMICONDUCTING GLASS; SEMICONDUCTING SILICON; WAFER BONDING;

HERMETICITY; LASER BONDING; MICROSYSTEMS PACKAGING;

MEMS;

EID: 34547738607     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2007.896704     Document Type: Article

References (26)

1. A. S. Holmes, "Laser fabrication and assembly processes for MEMS," Proc. SPIE, vol. 4274, pp. 297-306, 2001.
2. P. K. Subrahmanyan, "Laser micromachining in the microelectronics industry: Emerging applications," Proc. SPIE, vol. 4977, pp. 188-197, 2003.
3. M. Dirscherl, G. Esser, S. Kaufmann, and M. Geiger, "New developments in laser processing of silicon devices," Proc. SPIE, vol. 4977, pp. 57-69, 2003.
4. M. J. Madou, Fundamentals of Microfabrication. Boca Raton, FL: CRC Press, 2002, pp. 478-496.
5. L. Lin, "MEMS post-packaging by localized heating and bonding," IEEE Trans. Adv. Packag., vol. 23, no. 4, pp. 608-616, Nov. 2000.
6. L. Lin, Y. T. Cheng, and K. Najafi, "Formation of silicon-gold eutectic bond using localized heating method," Jpn. J. Appl. Phys. 2, Lett. vol. 37, no. 11B, pp. 1412-1414, Nov. 1998.
7. Y. T. Cheng, W. T. Hsu, K. Najafi, C. T. C. Nguyen, and L. Lin, "Vacuum packaging technology using localized aluminum/silicon-to-glass bonding," J. Microelectromech. Syst., vol. 11, no. 5, pp. 556-565, Oct. 2002.
8. Y. T. Cheng, L. Lin, and K. Najafi, "Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging," J. Microelectromech. Syst., vol. 9, no. 1, pp. 3-8, 2000.
9. R. J. K. Wassink, Soldering in Electronics. Ayr, U.K.: Electrochemical Publications, 1984.
10. H. Noh, K. Moon, A. Cannon, P. J. Hesketh, and C. P. Wong, "Wafer bonding using microwave heating of parylene for MEMS packaging," in Proc. IEEE Int. Conf. Electron. Compon. and Technol., 2004, vol. 1, pp. 924-930.
11. H. A. Yang, M. Wu, and W. Fang, "Localized induction heating solder bonding for wafer level MEMS packaging," in Proc. IEEE Int. Conf. Micro Electro Mech. Syst., 2004, pp. 729-732.
12. A. Gillner, M. J. Wild, and R. Poprawe, "Laser bonding of micro optical components," Proc. SPIE, vol. 4941, pp. 112-120, 2003.
13. R. Witte, H. Herfurth, and S. Heinemann, "Laser joining of glass with silicon," Proc. SPIE, vol. 4637, pp. 487-495, 2002.
14. U. M. Mescheder, M. Alavi, K. Hiltmann, C. Lietzau, C. Nachtigall, and H. Sandmaier, "Local laser bonding for low temperature budget," Sens. Actuators A, Phys., vol. 97/98, pp. 422-427, 2002.
15. C. Luo and L. Lin, "The application of nanosecond-pulsed laser welding technology in MEMS packaging with a shadow mask," Sens. Actuators A, Phys., vol. 97/98, pp. 398-404, 2002.
16. A. W. Y. Tan and F. E. H. Tay, "Localized laser assisted eutectic bonding of quartz and silicon by Nd:YAG pulsed-laser," Sens. Actuators A, Phys., vol. 120, no. 2, pp. 550-561, 2005.
17. Cyclotene 4000 Series Resin Data, 2006, Midland, MI: The Dow Chemical Company. Online. Available: http://www.dow.com/cyclotene/ index.htm
18. T. K. A. Chou and K. Najafi, "3D MEMS fabrication using low-temperature wafer bonding with benzocyclobutene (BCB)," in Proc. Transducers, 2001, pp. 1570-1573.
19. J. Oberhammer, F. Niklaus, and G. Stemme, "Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities," Sens. Actuators A, Phys., vol. 105, no. 3, pp. 297-304, 2003.
20. J. Oberhammer, F. Niklaus, and G. Stemme, "Sealing of adhesive bonded devices on wafer level," Sens. Actuators A, Phys., vol. 110, no. 1-3, pp. 407-412, 2004.
21. J. Oberhammer and G. Stemme, "BCB contact printing for patterned adhesive full-wafer bonded 0-level packages," J. Microelectromech. Syst., vol. 14, no. 2, pp. 419-425, Apr. 2005.
22. A. Jourdain, H. Ziad, P. De Moor, and H. A. C. Tilmans, "Wafer-scale 0-level packaging of (RF-)MEMS devices using BCB," in Proc. IEEE Conf. Des., Test, Integr. and Packag. MEMS/MOEMS, 2003, pp. 239-244.
23. A. Jourdain, P. De Moor, K. Baert, I. De Wolf, and H. A. C. Tilmans, "Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-)MEMS devices," J. Micromech. Microeng., vol. 15, no. 7, pp. S89-S96, Jul. 2005.
24. F. G. Bachmann and U. A. Russek, "Laser welding of polymers using high power diode lasers," Proc. SPIE, vol. 5121, pp. 385-398, 2003.
25. P. E. Garrou, R. H. Heistand, M. Dibbs, T. A. Manial, C. Mohler, T. Stokich, P. H. Townsend, G. M. Adema, M. J. Berry, and L. Turlik, "Rapid thermal curing of BCB dielectric," IEEE Trans. Compon., Packag., Manuf. Technol., vol. 16, no. 1, pp. 46-52, Feb. 1993.
26. A. Jourdain, P. De Moor, S. Pamidighantam, and H. A. C. Tilmans, "Investigation of the hermeticity of BCB-sealed cavities for housing (RF-) MEMS devices," in Proc. IEEE Micro Electro Mech. Syst., 2002, pp. 677-680.