SCOPUS 정보 검색 플랫폼

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2004, Pages 729-732

Localized induction heating solder bonding for wafer level MEMS packaging

(3) Yang, Hsueh An a Wu, Mingching a Fang, Weileun a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BOND STRENGTH (MATERIALS); BONDING; ELECTROPLATING; ETCHING; EVAPORATION; HEATING; MAGNETIC FILMS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS; TEMPERATURE DISTRIBUTION;

ELECTROPLATED FILM; MAGNETIC INDUCTION COIL; SOLDER BONDING; WAFER LEVEL PACKAGE;

INDUCTION HEATING;

EID: 3042739426 PISSN: 10846999 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (12)

References (9)

1
- 0003610581
- Elsevier, Amsterdam
- C.D. Fung, P.W. Cheung, W.H. Ko and D.G. Fleming (eds), Micromachining and Micro Packaging of Transducers, Elsevier, Amsterdam, 1985.
- (1985) Micromachining and Micro Packaging of Transducers
- Fung, C.D.¹ Cheung, P.W.² Ko, W.H.³ Fleming, D.G.⁴

2
- 0004169367
- New York, NY: McGraw-Hall
- G. T. A. Kovacs, Micromachined Transducers Sourcebook, New York, NY: McGraw-Hall, 2000.
- (2000) Micromachined Transducers Sourcebook
- Kovacs, G.T.A.¹

3
- 0036772724
- Vacuum packaging technology using localized aluminum/silicon-to-glass bonding
- Y.T. Cheng, W.T. Hsu, K. Najafi, T.C. Nguyen, and L. Lin, "Vacuum Packaging Technology Using Localized Aluminum/Silicon-to-Glass Bonding," J. of MEMS, Vol. 11, 2002
- (2002) J. of MEMS , vol.11
- Cheng, Y.T.¹ Hsu, W.T.² Najafi, K.³ Nguyen, T.C.⁴ Lin, L.⁵

4
- 0034317743
- MEMS post-packaging by localized heating and bonding
- L. Lin, "MEMS Post-Packaging by Localized Heating and Bonding," IEEE Trans. on Advanced Packaging, V. 23, 2000.
- (2000) IEEE Trans. on Advanced Packaging , vol.23
- Lin, L.¹

5
- 0036124049
- Long-term testing of hermetic anodically bonded glass-silicon packages
- Las vegas, Nevada, January 20-24
- T. J. Harpster and K. Najafi, "Long-term testing of hermetic anodically bonded glass-silicon packages", MEMS 2002, IEEE international conference, Las vegas, Nevada, January 20-24, 2002, pp423-426.
- (2002) MEMS 2002, IEEE International Conference , pp. 423-426
- Harpster, T.J.¹ Najafi, K.²

6
- 0033752127
- Wafer level packaging of silicon pressure sensors
- H. Krassow, F. Campabadal, E. L. Tamayo, "Wafer level packaging of silicon pressure sensors", Sensors and Actuators A, Vol. 82, 2000, pp. 229-233.
- (2000) Sensors and Actuators A , vol.82 , pp. 229-233
- Krassow, H.¹ Campabadal, F.² Tamayo, E.L.³

7
- 0035506511
- Wafer-to-wafer bonding of nonplanarized MEMS surfaces using solder
- D. Sparks, G. Queen, R. Weston, G. Woodward, M. Putty, L. Jordan, S. Zarabadi and K. Jayakar., "Wafer-to-wafer bonding of nonplanarized MEMS surfaces using solder", J. Micromech. Microeng, Vol. 11, 2001, pp.630-634.
- (2001) J. Micromech. Microeng , vol.11 , pp. 630-634
- Sparks, D.¹ Queen, G.² Weston, R.³ Woodward, G.⁴ Putty, M.⁵ Jordan, L.⁶ Zarabadi, S.⁷ Jayakar, K.⁸

8
- 0035277919
- Low-temperature full wafer adhesive bonding
- F. Niklaus, P. Enoksson, E. Kalvesten and G. Stemme, "Low- temperature full wafer adhesive bonding", J. Micromech. Microeng, Vol. 11, 2001, pp. 100-107.
- (2001) J. Micromech. Microeng , vol.11 , pp. 100-107
- Niklaus, F.¹ Enoksson, P.² Kalvesten, E.³ Stemme, G.⁴

9
- 0034246546
- Wafer bonding by low-temperature soldering
- C. K. Lee, W. F. Huang, and J. S. Shie, "Wafer bonding by low-temperature soldering", Sensors and Actuatosr A, Vol. 85, 2000, pp. 330-334.
- (2000) Sensors and Actuatosr A , vol.85 , pp. 330-334
- Lee, C.K.¹ Huang, W.F.² Shie, J.S.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.