Prospective development in diffusion barrier layers for copper metallization in LSI

Microelectronics Journal

Volumn 38, Issue 6-7, 2007, Pages 777-782

  Wong, H Y ^a   Mohd Shukor, N F ^a   Amin, N ^b  

^a MULTIMEDIA UNIVERSITY   (Malaysia)

^b UNIVERSITI KEBANGSAAN MALAYSIA   (Malaysia)

Author keywords

Barrier layers materials; Copper interconnection

Indexed keywords

COPPER COMPOUNDS; DIFFUSION; LSI CIRCUITS; METALLIZING;

BARRIER LAYERS MATERIALS; COPPER INTERCONNECTION; COPPER METALLIZATION; INTERCONNECT METALLIZATION;

INTERCONNECTION NETWORKS;

EID: 34547409945     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2007.04.011     Document Type: Article

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