Characterization of sputtered nano-crystalline zirconiur carbide as a diffusion barrier for Cu metallization

Journal of Electronic Materials

Volumn 34, Issue 11, 2005, Pages 1408-1413

  Chen, Cheng Shi ^a   Liu, Chuan Pu ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Barrier; Metallization; Sputtering; Zirconium carbide (ZrC)

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; COPPER; ELECTRIC CONDUCTIVITY; MAGNETRON SPUTTERING; METALLIZING; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; TEMPERATURE DISTRIBUTION; THERMODYNAMIC STABILITY; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

BARRIER; GROWTH TEMPERATURE; ZIRCONIUM CARBIDE (ZRC);

ZIRCONIUM COMPOUNDS;

EID: 28044467172     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0198-y     Document Type: Article

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