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Volumn 476, Issue 1, 2005, Pages 142-147
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Diffusion barrier performances of thin Mo, Mo-N and Mo/Mo-N films between Cu and Si
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Author keywords
Copper metallization; Diffusion barrier; Molybdenum; Sputtering
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Indexed keywords
DIFFUSION IN SOLIDS;
METALLIC FILMS;
PARAMETER ESTIMATION;
PROTECTIVE COATINGS;
SCANNING ELECTRON MICROSCOPY;
SUBSTRATES;
THERMAL EFFECTS;
X RAY DIFFRACTION;
COPPER METALLIZATION;
DIFFUSION BARRIER;
DIRECT CURRENT (DC) SPUTTERING;
MO-BASED BARRIER MATERIALS;
THIN FILMS;
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EID: 13844256787
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tsf.2004.09.046 Document Type: Article |
Times cited : (63)
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References (20)
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