Formation of Ti diffusion barrier layers in thin Cu(Ti) alloy films

Journal of Electronic Materials

Volumn 34, Issue 5, 2005, Pages 592-599

  Tsukimoto, S ^a   Morita, T ^a   Moriyama, M ^b   Ito, Kazuhiro ^a   Murakami, Masanori ^a  

^a KYOTO UNIVERSITY   (Japan)

^b Toyoda Gosei Co Ltd   (Japan)

Author keywords

Alloy element; Barrier layer; Cu(Ti) film; Selection rule; Self formation

Indexed keywords

ANNEALING; COPPER; DIFFUSION; ELECTRIC CONDUCTIVITY; METALLIC FILMS; MICROSTRUCTURE; OPTICAL INTERCONNECTS; SILICA; TITANIUM;

ALLOY ELEMENT; BARRIER LAYER; CU(TI) FILM; SELECTION RULE; SELF-FORMATION;

THIN FILMS;

EID: 20344406228     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0070-0     Document Type: Conference Paper

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