A bonded joint analysis for surface mount components

Journal of Electronic Packaging, Transactions of the ASME

Volumn 114, Issue 1, 1992, Pages 1-7

  Yamada, S E ^a  

^a MOLEX INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

JOINTS - SOLDERED; MATHEMATICAL TECHNIQUES - FINITE ELEMENT METHOD; STRESSES - ANALYSIS; STRUCTURAL DESIGN - STRESSES;

BONDED JOINTS; HYPERBOLIC FUNCTIONS; PEEL STRESS;

ELECTRONICS PACKAGING;

EID: 0026839914     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2905436     Document Type: Article

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