Chip on paper technology utilizing anisotropically conductive adhesive for smart label applications

Microelectronics Reliability

Volumn 44, Issue 1, 2004, Pages 135-140

  Rasul, Jad S ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ANISOTROPY; ANTENNAS; ATMOSPHERIC HUMIDITY; CONDUCTIVE MATERIALS; CURING; DIELECTRIC MATERIALS; ELECTRONICS PACKAGING; SCREEN PRINTING; SILICON; TRANSPONDERS;

ANISOTROPICALLY CONDUCTIVE ADHESIVES (ACA); RADIO FREQUENCY IDENTIFICATION SYSTEM (RFID); SMART LABELS;

FLIP CHIP DEVICES;

EID: 0348042925     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00240-3     Document Type: Article

References (8)

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3. Lynos A.M., Wang C.P. Recent advances and evaluation of anisotropically conductive adhesives for microelectronics assembly. Liu J. Conductive adhesives for electronics packaging. 1999;181-211 Electrochemical Publ. London, UK.
4. McGovern L.P., Baldwin D.F. High throughput low cost flip chip-on-board assembly. Electron. Packag. Product. 38(2):1998;68-76.
5. Wang CP, Shi S, Jefferson G. High performance, low cost underfills for flip chip applications. In: IEEE 45th ECTC Proceedings, San Diego, CA, 1997.
6. Lai Z., Liu J. Anisotropically conductive adhesive flip chip bonding on rigid and flexible printed circuit substrates. IEEE Trans. Comp. Packag. Manufact. Technol. B. 19(August):1996;660-664.
7. Tootoonchi A, Rasul J. Low cost flip chip on paper assembly utilizing non-thermal cure materials. In: SMTA International Proceedings, Chicago, IL, 2001.
8. Rasul J, Olson W. Flip chip on paper assembly utilizing anisotropic conductive adhesive. In: IEEE 52nd ECTC Proceedings, San Diego, CA, 2002.