Adhesion issues in epoxy-based chip attach adhesives

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 1, 1997, Pages 31-37

  Pearson, Raymond A ^a   Lloyd, Tom B ^a   Azimi, Hamid R ^c   Hsiung, Jen Chou ^a   Early, Malcolm S ^b   Brandenburger, Peter D ^c  

^a LEHIGH UNIVERSITY   (United States)

^b SUN MICROSYSTEMS   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

Adhesion; Bondability diagrams; Chip attach

Indexed keywords

ADHESION; DEGRADATION; EPOXY RESINS; FRACTURE MECHANICS; INTERFACES (MATERIALS); PLASTIC ADHESIVES; REACTION KINETICS; SHRINKAGE; STRENGTH OF MATERIALS; STRESS INTENSITY FACTORS; SUBSTRATES; SURFACES;

BONDABILITY DIAGRAM; CURE KINETICS; EPOXY BASED CHIP ATTACH ADHESIVES; LEADFRAME SUBSTRATES; SURFACE CHEMISTRY;

ELECTRONICS PACKAGING;

EID: 0031094263     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.558541     Document Type: Article

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