Humidity and Reflow Resistance of Flip Chip on Foil Assemblies With Conductive Adhesive Joints

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 3, 2003, Pages 563-568

  De Vries, J ^a   Janssen, Esther ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

Conductive adhesive; Endurance test; Failure mechanism; Flexible substrate; Flip chip; Interconnections; Reflow soldering

Indexed keywords

ADHESIVES; ATMOSPHERIC HUMIDITY; SOLDERING;

REFLOW RESISTANCE;

FLIP CHIP DEVICES;

EID: 0142195944     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.817647     Document Type: Article

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