An analytical model for thermal stress analysis of multi-layered microelectronic packaging

Mechanics of Materials

Volumn 36, Issue 4, 2004, Pages 369-385

  Wen, Yujun ^a   Basaran, Cemal ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

Interfacial delamination; Interfacial stress; Microelectronic packaging; Moir interferometry; Multi layered structure

Indexed keywords

DELAMINATION; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); INTERFEROMETRY; MATHEMATICAL MODELS; MULTILAYERS; STRESS ANALYSIS; SUBSTRATES; THERMAL STRESS;

INTERFACIAL DELAMINATION; INTERFACIAL STRESS;

ELECTRONICS PACKAGING;

EID: 0346094002     PISSN: 01676636     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-6636(03)00076-0     Document Type: Article

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