Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 20, Issue 2, 1997, Pages 95-100

  Aschenbrenner, Rolf ^a   Ostmann, Andreas ^a   Motulla, Gerald ^a   Zakel, Elke ^a   Reichl, Herbert ^a  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ADHESIVES; ATMOSPHERIC HUMIDITY; BONDING; CONDUCTIVE MATERIALS; ELECTRIC RESISTANCE; FLIP CHIP DEVICES; OHMIC CONTACTS; THERMAL EFFECTS;

ANISOTROPIC CONDUCTIVE ADHESIVES (ACA); CHIP ON FLEX (COF) BONDING; CHIP ON GLASS (COG) BONDING; ELECTROLESS NICKEL BUMPING;

ELECTRONICS PACKAGING;

EID: 0031122514     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.622879     Document Type: Article

References (16)