Multichip Package Delamination and Die Fracture Analysis

IEEE Transactions on Advanced Packaging

Volumn 26, Issue 2, 2003, Pages 152-159

  Mercado, Lei L ^a   Wieser, Hubert ^a   Hauck, Torsten ^a  

^a IEEE   (United States)

Author keywords

Crack branching; Delamination; Die cracking; Finite element analysis; Interface fracture mechanics; Mechatronic packages; Mold compound; Multichip modules; Package failure; Popcorning

Indexed keywords

AUTOMOTIVE ENGINEERING; COMPUTER SIMULATION; FINITE ELEMENT METHOD; MULTICHIP MODULES;

DIE CRACKS;

ELECTRONICS PACKAGING;

EID: 0141882975     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.817335     Document Type: Article

References (5)

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4. M. Y. He and J. W. Hutchinson, "Kinking of a crack out of an interface," J. Appl. Mech., vol. 56, pp. 270-278, 1989.
5. R. Yuuki and J.-Q. Xu, "Stress based criterion for an interface crack kinking out of the interface in dissimilar materials," Eng. Fracture Mech., vol. 41, no. 5, pp. 635-644, 1992.