Thermal stability of Ti/Al/Pt/Au and Ti/Au Ohmic contacts on n-type ZnCdO

Applied Surface Science

Volumn 253, Issue 2, 2006, Pages 746-752

  Chen, Jau Jiun ^a,b   Jang, Soohwan ^a,b   Ren, F ^a,b   Rawal, S ^c   Li, Yuanjie ^c   Kim, Hyun Sik ^c   Norton, D P ^c   Pearton, S J ^c   Osinsky, A ^c  

^a University of Florida   (United States)

^b UNIVERSITY OF FLORIDA   (United States)

^c SVT ASSOCIATES   (United States)

Author keywords

Ohmic contacts; ZnCdO

Indexed keywords

FILM GROWTH; GALLIUM NITRIDE; OHMIC CONTACTS; THERMODYNAMIC STABILITY; ZINC OXIDE;

ANNEALING TEMPERATURE; CHEMICAL INTERMIXING; CONTACT RESISTIVITY; TRANSFER RESISTANCE;

TITANIUM ALLOYS;

EID: 33845450221     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2006.01.012     Document Type: Article

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