Analytical elasto-creep model of interfacial thermal stresses and strains in trilayer assemblies

International Journal of Solids and Structures

Volumn 43, Issue 25-26, 2006, Pages 7424-7449

  Ghorbani, Hamid R ^a   Spelt, Jan K ^a  

^a UNIVERSITY OF TORONTO   (Canada)

Author keywords

Adhesive bond; Creep; Hysteresis; Interfacial stress; Laminated; Layered beam; Ratcheting; Shakedown; Solder joint; Strain energy; Stress singularity; Thermal cycling; Thermal strain; Thermal stress; Trilayer; Viscoelastic

Indexed keywords

APPROXIMATION THEORY; CREEP; CYCLIC LOADS; ENERGY DISSIPATION; FINITE DIFFERENCE METHOD; FINITE ELEMENT METHOD; HYSTERESIS; INTERFACES (MATERIALS); LAMINATED COMPOSITES; SURFACE TENSION; THERMAL CYCLING;

ADHESIVE BOND; INTERFACIAL STRESS; LAYERED BEAMS; RATCHETING; SOLDER JOINTS; STRAIN ENERGY; STRESS SINGULARITY;

THERMAL STRESS;

EID: 33750314860     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2006.02.003     Document Type: Article

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