Interfacial creep in multi-component material systems

JOM

Volumn 55, Issue 1, 2003, Pages 38-43

  Dutta, I ^a   Peterson, K A ^a   Park, C ^a  

^a NAVAL POSTGRADUATE SCHOOL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; INTERFACES (MATERIALS); SHEAR STRESS; SUBSTRATES; THERMAL EXPANSION; THIN FILMS;

MULTI-COMPONENT MATERIAL SYSTEMS;

MATERIALS SCIENCE;

EID: 0037279864     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11837-003-0192-x     Document Type: Review

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