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Volumn , Issue , 1986, Pages 383-392
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CALCULATED THERMALLY INDUCED STRESSES IN ADHESIVELY BONDED AND SOLDERED ASSEMBLIES.
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
BONDING;
MICROELECTRONICS;
SOLDERING;
STRESSES - THERMAL;
TIMOSHENKO THEORY;
ELECTRONICS PACKAGING;
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EID: 0022938018
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (110)
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References (7)
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