Interfacial thermal stresses in trilayer assemblies

Journal of Electronic Packaging

Volumn 127, Issue 3, 2005, Pages 314-323

  Ghorbani, H R ^a   Spelt, J K ^a  

^a UNIVERSITY OF TORONTO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATION THEORY; DIFFERENTIAL EQUATIONS; ELASTICITY; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); STRAIN;

GAAS THIN-FILM STRUCTURES; INELASTIC BEHAVIOR; MATERIALS THEORIES; PEEL STRESSES;

THERMAL STRESS;

EID: 26844490150     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1938205     Document Type: Article

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