Photoelastic Investigation of Bimaterial Interfacial Stresses Induced by Thermal Loading

Strain

Volumn 39, Issue 4, 2003, Pages 143-148

  Wang, W C ^a   Lin, J C ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Bimaterial; Electronic packaging; Finite element method; Photoelasticlty; Thermal stresses

Indexed keywords

ELASTIC MODULI; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); PHOTOELASTICITY; POISSON RATIO; STRESS ANALYSIS; STRUCTURAL DESIGN; STRUCTURAL LOADS; SURFACES; THERMAL LOAD;

BIMATERIAL STRUCTURES; INTERFACIAL STRESSES;

THERMAL STRESS;

EID: 0347533783     PISSN: 00392103     EISSN: None     Source Type: Journal    
DOI: 10.1046/j.1475-1305.2003.00087.x     Document Type: Article

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