Interfacial thermal stress analysis of anisotropic multi-layered electronic packaging structures

Journal of Electronic Packaging, Transactions of the ASME

Volumn 122, Issue 1, 2000, Pages 61-66

  Xie, Weidong ^a   Sitaraman, Suresh K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041083290     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.483133     Document Type: Article

References (24)

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