Residual stress development in adhesive joints subjected to thermal cycling

Journal of Adhesion

Volumn 65, Issue 1-4, 1998, Pages 277-306

  Humfeld Jr , G Robert ^a   Dillard, David A ^a  

^a Virginia Polytechnic Institute and State University   (United States)

Author keywords

Adhesive bond; Coatings; Polymer; Residual stress; Stress relaxation; Thermal cycling; Thermal ratchetting; Thermal stress; Thermoviscoelasticity; Time temperature superposition; Viscoelasticity

Indexed keywords

APPROXIMATION THEORY; FINITE ELEMENT METHOD; PLASTIC FILMS; RESIDUAL STRESSES; STRAIN RATE; STRESS RELAXATION; TENSILE STRESS; THERMAL CYCLING; THERMAL EFFECTS; THERMAL STRESS; THERMOELASTICITY; VISCOELASTICITY;

DEBONDING; THERMAL RATCHETTING;

ADHESIVE JOINTS;

EID: 0031641275     PISSN: 00218464     EISSN: None     Source Type: Journal    
DOI: 10.1080/00218469808012250     Document Type: Article

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